Description: The 0021-33621 AMAT is identified as a SHLD MIDDLE MATRIX CU ENDURA 2, likely a middle shield component made of Copper (Cu) and designed for the ENDURA 2 platform from Applied Materials (AMAT). This shield is a crucial part within AMAT’s Physical Vapor Deposition (PVD) systems, specifically used in the ENDURA 2 chamber for…
Description: The 0021-16781 AMAT is identified as a SHIELD, UPPER, 300MM, REV 2.0 SIP CU from Applied Materials (AMAT). This is a crucial component within AMAT’s Physical Vapor Deposition (PVD) systems, specifically designed for 300mm wafer processing utilizing SIP (Single In-situ Plasma) Copper technology. This upper shield plays a vital role in protecting specific areas…
Description: The 0020-63185 AMAT is identified as a BLOCKER PLATE, UNIFORM FLOW -0.2 BP STAN, manufactured by Applied Materials (AMAT). This component is utilized in AMAT’s semiconductor processing equipment, likely within a Chemical Vapor Deposition (CVD) chamber, to ensure a uniform distribution of process gases across the wafer surface. The “BP STAN” likely refers to…
Description: The 0021-03721 AMAT is identified as a HALOGEN RESISTANT XE REFLECTOR PLATE, specifically designed for use in Applied Materials (AMAT) Rapid Thermal Processing (RTP) chambers that utilize Xenon (Xe) lamps for heating. This reflector plate is a critical component for directing and focusing the intense light energy from the Xe lamps onto the semiconductor…
Description: The 0020-39360 AMAT is identified as a BAFFLE, likely a component used within Applied Materials (AMAT) semiconductor processing equipment. Baffles are typically employed to control gas flow, plasma confinement, or particle movement within the process chamber, contributing to uniformity and efficiency in various fabrication steps. Application Scenarios: Consider a plasma etching process in an…
Description: The 0020-39361 AMAT is identified as a RACE, LOWER, BEARING, UPPER ROTATION, specifically for Rapid Thermal Processing (RTP) equipment manufactured by Applied Materials (AMAT). This is a critical mechanical component that likely supports and enables the precise rotation of parts within the high-temperature environment of the RTP chamber, ensuring uniform thermal processing of semiconductor…
Description: The 0020-26374 AMAT is identified as a Clamp Middle Shield designed for 300mm wafer processing equipment manufactured by Applied Materials (AMAT), specifically for their ENCORE platform using SIP (Single In-situ Plasma) Copper technology. This component is crucial for maintaining the integrity of the processing environment and ensuring proper wafer handling during sensitive semiconductor fabrication…
Description: The 0020-26822 AMAT is identified as a SHIELD 8″ HTHU DEPO LOW KNEE from Applied Materials (AMAT). This component is a crucial part within AMAT’s thin film deposition equipment, specifically designed to protect certain areas during the deposition process on 8-inch wafers. The “HTHU” likely refers to a specific hardware configuration or process within…
Description: The 002-3830-01 AMAT is identified as a Door Cylinder VCE SMC RBQC2007, though the listing on platforms like eBay indicates it might be associated with Brooks Automation US, LLC, rather than Applied Materials directly for this specific part number. This pneumatic cylinder is likely used for automated door mechanisms within semiconductor manufacturing equipment, providing…
Description: The 0010-68129 AMAT is a Vectra IMP (Inductively Coupled Plasma) Source RF Match, operating at 200MHz, and part of the ICE (Integrated Control Electronics) 3.1 series, specifically designed for 300mm wafer processing equipment from Applied Materials (AMAT). This critical assembly is responsible for ensuring efficient power transfer from the RF generator to the ICP…
