Description: The 0010-37867 AMAT is identified as an Internal ISRM (Interferometry based Spatially Resolved Metrology) Module Assembly from Applied Materials (AMAT). This module likely incorporates a miniature diode laser and is a critical component within AMAT’s advanced semiconductor manufacturing equipment, used for precise metrology and inspection processes. Application Scenarios: Consider a semiconductor fabrication plant producing…
Based on the available information, the AMAT 0010-32695 is a PEDESTAL ASSEMBLY, SICONI CLEAN, 300MM PRODUCER GT, used in Applied Materials (AMAT) semiconductor manufacturing equipment. Detailed Parameter Table Parameter name Parameter value Product model 0010-32695 Manufacturer Applied Materials (AMAT) Product category 300mm Pedestal Assembly Application Semiconductor Manufacturing Equipment (Likely Etch or Deposition) Wafer Size Compatibility…
Based on the available information, the AMAT 0010-28715 is a 300mm HTR MCA SST Heater Purge Ring, also described as a 300mm Electrostatic Chuck (ESC) Heater with Purge Functionality. The “SST” likely refers to Stainless Steel construction. This component is used in Applied Materials (AMAT) semiconductor manufacturing equipment for controlling the temperature of the electrostatic…
Based on the available information, the AMAT 0040-91179 is a 300MM MCA E-CHUCK TXZ HEATER/PURGE ASSEMBLY. This component is used in Applied Materials (AMAT) semiconductor manufacturing equipment, specifically for controlling the temperature and potentially providing a purge gas flow for a 300mm Multi-Channel Analyzer (MCA) Electrostatic Chuck (E-Chuck). The “TxZ” designation likely refers to a…
Based on the available information, the AMAT 0010-27983 is a 300MM MCA E-CHUCK ESC HEATER, also referred to as a PIB HTB2 MCA ESC Heater. This is a critical component used in Applied Materials (AMAT) semiconductor manufacturing equipment for controlling the temperature of the electrostatic chuck (ESC) that holds 300mm wafers during processing. Detailed Parameter…
Based on the available information, the AMAT 0010-27431 is identified as a PEDESTAL, 300MM PIB HT BESC ASSY, 9″ KOV. This is a critical component used in Applied Materials (AMAT) semiconductor manufacturing equipment, specifically a heated electrostatic chuck (ESC) pedestal assembly for 300mm wafers, likely within a Physical Vapor Deposition (PVD) system. The “PIB” likely…
Based on the available information, the AMAT 0010-25739 is a 300mm Magnet Assembly, specifically identified as a HY-11 MAGNET 300MM DS TTN used in Applied Materials (AMAT) semiconductor manufacturing equipment, likely within a Physical Vapor Deposition (PVD) system such as the Endura II. Detailed Parameter Table Parameter name Parameter value Product model 0010-25739 Manufacturer Applied…
Based on the available information, the AMAT 0010-23716 is identified as a LOWER ROBOT ASSEMBLY, used in Applied Materials (AMAT) semiconductor manufacturing equipment for wafer handling. This component is a crucial part of the robotic system that transfers silicon wafers between different modules within the processing tool. Detailed Parameter Table Parameter name Parameter value Product…
Based on the available information, the AMAT 0010-22985 is a 300MM MCA (Multi-Channel Analyzer) Assembly, likely an E-Chuck (Electrostatic Chuck) assembly used in Applied Materials (AMAT) semiconductor manufacturing equipment for handling 300mm wafers. Detailed Parameter Table Parameter name Parameter value Product model 0010-22985 Manufacturer Applied Materials (AMAT) Product category 300mm MCA E-Chuck Assembly Application Semiconductor…
Based on the available information, the AMAT 0010-19534 is identified as an ASSEMBLY, BEARING, UPPER ROTATION, SPEC (NEW), used in Applied Materials (AMAT) semiconductor manufacturing equipment. While the specific system or process where this bearing is utilized isn’t immediately clear, its function as an upper rotation bearing suggests it is part of a mechanism involving…
