0020-39360 AMAT

Description: The 0020-39360 AMAT is identified as a BAFFLE, likely a component used within Applied Materials (AMAT) semiconductor processing equipment. Baffles are typically employed to control gas flow, plasma confinement, or particle movement within the process chamber, contributing to uniformity and efficiency in various fabrication steps. Application Scenarios: Consider a plasma etching process in an…

0020-39361 AMAT

Description: The 0020-39361 AMAT is identified as a RACE, LOWER, BEARING, UPPER ROTATION, specifically for Rapid Thermal Processing (RTP) equipment manufactured by Applied Materials (AMAT). This is a critical mechanical component that likely supports and enables the precise rotation of parts within the high-temperature environment of the RTP chamber, ensuring uniform thermal processing of semiconductor…

0020-26374 AMAT

Description: The 0020-26374 AMAT is identified as a Clamp Middle Shield designed for 300mm wafer processing equipment manufactured by Applied Materials (AMAT), specifically for their ENCORE platform using SIP (Single In-situ Plasma) Copper technology. This component is crucial for maintaining the integrity of the processing environment and ensuring proper wafer handling during sensitive semiconductor fabrication…

0020-26822 AMAT

Description: The 0020-26822 AMAT is identified as a SHIELD 8″ HTHU DEPO LOW KNEE from Applied Materials (AMAT). This component is a crucial part within AMAT’s thin film deposition equipment, specifically designed to protect certain areas during the deposition process on 8-inch wafers. The “HTHU” likely refers to a specific hardware configuration or process within…

002-3830-01 AMAT

Description: The 002-3830-01 AMAT is identified as a Door Cylinder VCE SMC RBQC2007, though the listing on platforms like eBay indicates it might be associated with Brooks Automation US, LLC, rather than Applied Materials directly for this specific part number. This pneumatic cylinder is likely used for automated door mechanisms within semiconductor manufacturing equipment, providing…

0010-68129 AMAT

Description: The 0010-68129 AMAT is a Vectra IMP (Inductively Coupled Plasma) Source RF Match, operating at 200MHz, and part of the ICE (Integrated Control Electronics) 3.1 series, specifically designed for 300mm wafer processing equipment from Applied Materials (AMAT). This critical assembly is responsible for ensuring efficient power transfer from the RF generator to the ICP…

0010-56222 AMAT

Description: The 0010-56222 AMAT is a Ceramic Dual Zone Heater manufactured by Applied Materials (AMAT). This heater is a crucial component within AMAT’s semiconductor processing equipment, providing precise and independent temperature control across different zones of a substrate, likely a silicon wafer, during critical manufacturing steps. Application Scenarios: Consider a thin film deposition process in…

0010-65306 AMAT

Description: The 0010-65306 AMAT is identified as a Match Network Assembly from Applied Materials (AMAT). This critical module is an integral part of the Radio Frequency (RF) power delivery system in AMAT’s plasma processing equipment, such as plasma etching and chemical vapor deposition (CVD) systems. Its primary function is to efficiently transfer RF power from…

0010-49013 AMAT

Description: The 0010-49013 AMAT is an AC Servo Motor, likely manufactured by Sanyo Denki and used within Applied Materials (AMAT) semiconductor manufacturing equipment. This motor provides precise and reliable rotational motion for various automated tasks within AMAT’s advanced systems. Application Scenarios: Consider a robotic arm within an AMAT wafer handling system, responsible for the delicate…

0010-47763 AMAT

Description: The 0010-47763 AMAT is identified as an Electrostatic Chuck (ESC) Assembly, specifically a Bonded Monopolar Dual Heated ESC, manufactured by Applied Materials (AMAT). This critical component is used in AMAT’s plasma etching and other thin film deposition systems within semiconductor manufacturing, responsible for securely holding and controlling the temperature of silicon wafers during processing.…