0010-27431 AMAT

Based on the available information, the AMAT 0010-27431 is identified as a PEDESTAL, 300MM PIB HT BESC ASSY, 9″ KOV. This is a critical component used in Applied Materials (AMAT) semiconductor manufacturing equipment, specifically a heated electrostatic chuck (ESC) pedestal assembly for 300mm wafers, likely within a Physical Vapor Deposition (PVD) system. The “PIB” likely refers to Polyimide bonding, “HT” for High Temperature, and “BESC” for Bottom Electrode Electrostatic Chuck. The “9” KOV” likely refers to a specific voltage rating (9 Kilovolts).

Detailed Parameter Table

Parameter name	Parameter value
Product model	0010-27431
Manufacturer	Applied Materials (AMAT)
Product category	300mm Heated Electrostatic Chuck (ESC) Pedestal Assembly
Application	Semiconductor Manufacturing Equipment (Physical Vapor Deposition – PVD)
Wafer Size Compatibility	300mm
Condition	Typically Refurbished or Used (New may be available)
Specific Designation	PEDESTAL, 300MM PIB HT BESC ASSY, 9″ KOV
Function	Provides electrostatic clamping and high-temperature control for 300mm wafers during PVD processes
Key Features	Polyimide bonding, High Temperature capability, Bottom Electrode Electrostatic Chuck, 9kV rating
Compatibility	Applied Materials PVD systems (e.g., Endura II, likely other 300mm platforms)

Product Introduction

The AMAT 0010-27431 is a high-performance PEDESTAL, 300MM PIB HT BESC ASSY, 9″ KOV, a vital assembly in Applied Materials (AMAT) semiconductor manufacturing equipment. Specifically designed for 300mm wafer processing, this AMAT 0010-27431 integrates electrostatic clamping (ESC) with high-temperature control capabilities, crucial for various Physical Vapor Deposition (PVD) processes. The “BESC” designation indicates a bottom electrode electrostatic chuck, while “PIB” likely refers to the polyimide bonding used in its construction, offering enhanced thermal stability. The “HT” signifies its ability to operate at high temperatures, and the “9” KOV” specifies its voltage rating for electrostatic clamping. Manufactured to meet Applied Materials’ stringent standards, the AMAT 0010-27431 ensures secure wafer holding and precise temperature management, both critical for achieving uniform and high-quality thin film deposition on 300mm silicon wafers. As a key component within AMAT’s advanced PVD systems, this pedestal assembly significantly contributes to the efficiency and yield of semiconductor fabrication.

Core Advantages and Technical Highlights

The AMAT 0010-27431 300mm Heated Electrostatic Chuck (ESC) Pedestal Assembly offers several key advantages for advanced PVD processes:

Secure Electrostatic Clamping: The integrated bottom electrode electrostatic chuck (BESC) provides reliable and uniform clamping force across the 300mm wafer, ensuring stability during the deposition process and preventing wafer movement.

High-Temperature Capability: The “HT” designation and polyimide bonding (“PIB”) indicate the assembly’s ability to operate at high temperatures, crucial for achieving specific film properties and process requirements in various PVD applications.

Precise Temperature Control: The heated pedestal ensures uniform temperature distribution across the 300mm wafer, which is critical for controlling the kinetics of the deposition process and achieving desired film characteristics.

Optimized for 300mm Wafers: Specifically designed for 300mm wafer processing, the AMAT 0010-27431 is a key enabler for high-throughput manufacturing on large-diameter substrates.

Seamless AMAT System Integration: As a genuine AMAT part, this pedestal assembly ensures seamless integration and compatibility with Applied Materials’ PVD equipment, guaranteeing optimal performance and reliability.

Contributes to Film Uniformity and Quality: Stable wafer clamping and precise temperature control facilitated by the 0010-27431 are essential for achieving uniform and high-quality thin film deposition, leading to improved device performance and yield.

Typical Application Scenarios

The AMAT 0010-27431 300mm Heated Electrostatic Chuck (ESC) Pedestal Assembly is a critical component in various PVD modules within Applied Materials’ 300mm semiconductor manufacturing equipment, such as the Endura II. In sputtering processes, the AMAT 0010-27431 securely holds the 300mm wafer while target materials are sputtered onto its surface. The integrated heating capability allows for precise control of the wafer temperature, which can influence film stress, grain size, and other critical properties. This assembly is essential for depositing various thin films used in semiconductor devices, including metals, nitrides, and oxides. The reliable electrostatic clamping ensures the wafer remains stationary and in good thermal contact with the pedestal, contributing to the uniformity and quality of the deposited layers across the large 300mm wafer surface.

Related Model Recommendations

Given that the AMAT 0010-27431 is a 300mm heated ESC pedestal assembly for AMAT PVD systems, related models would likely be other wafer chucks or components within the same or similar AMAT 300mm PVD equipment:

AMAT E-Chucks for different wafer sizes (e.g., 200mm): AMAT offers electrostatic chucks for various wafer diameters used in different generations of PVD equipment.
AMAT Pedestal Assemblies without integrated heating: For PVD processes that do not require wafer heating.
AMAT Pedestal Assemblies with different ESC configurations: Variations in electrode design or voltage ratings for specific process requirements.
AMAT RF Matching Units for E-Chucks: Components that optimize the power delivery to the electrostatic chuck.
AMAT Temperature Controllers for Pedestals: Dedicated controllers that manage the heating and cooling of the pedestal assembly.

Installation, Commissioning and Maintenance Instructions

Installation preparation: Before installing the AMAT 0010-27431, ensure that the AMAT PVD equipment is properly shut down and isolated from power and vacuum according to AMAT safety procedures. Verify that the new or refurbished 0010-27431 pedestal assembly is the correct part number and is free from any physical damage or contamination. Refer to the specific AMAT equipment manual for the PVD module for detailed step-by-step installation instructions, including proper alignment, thermal interface material application (if required), electrical connections for the ESC and heater, and any specific handling requirements for electrostatic sensitive components. Ensure that the mounting surfaces are clean and that all necessary hardware is available.

Maintenance suggestions: Regular monitoring of the wafer clamping force and temperature uniformity is essential to ensure the AMAT 0010-27431 is functioning correctly. Follow the maintenance schedule outlined in the AMAT equipment manual for the PVD module, which may include periodic cleaning of the ESC surface to remove any particle contamination that could affect clamping or thermal contact. Any signs of reduced clamping force, uneven temperature distribution, or electrical issues should be investigated promptly. Replacement of the 0010-27431 should be performed by trained personnel following AMAT’s recommended procedures. Using genuine AMAT replacement parts ensures proper fit and function, maintaining the system’s reliability and process quality. Regular calibration of the temperature control system is also crucial for consistent performance.