Based on the available information, the AMAT 0010-25739 is a 300mm Magnet Assembly, specifically identified as a HY-11 MAGNET 300MM DS TTN used in Applied Materials (AMAT) semiconductor manufacturing equipment, likely within a Physical Vapor Deposition (PVD) system such as the Endura II.
Detailed Parameter Table
Product Introduction
The AMAT 0010-25739 is a crucial 300mm Magnet Assembly, specifically the HY-11 MAGNET 300MM DS TTN, designed for use in Applied Materials (AMAT) semiconductor manufacturing equipment, primarily within Physical Vapor Deposition (PVD) systems like the Endura II. This AMAT 0010-25739 plays a vital role in the sputtering process by generating and shaping the magnetic field that confines the plasma above the target material. The precise configuration of this magnetic field is critical for achieving uniform sputtering rates and film deposition across the 300mm silicon wafer. Manufactured to Applied Materials’ stringent specifications, the AMAT 0010-25739 is essential for ensuring high-quality thin film deposition, which is a fundamental step in semiconductor fabrication. Its technical positioning emphasizes its contribution to process uniformity, deposition rate control, and overall equipment performance within AMAT’s advanced PVD platforms.
Core Advantages and Technical Highlights
The AMAT 0010-25739 300mm Magnet Assembly offers several key advantages for PVD processes in semiconductor manufacturing:
Optimized Magnetic Field Configuration: The 0010-25739, with its HY-11 designation and DS TTN specification, is engineered to provide a specific magnetic field profile that optimizes plasma confinement and uniformity over 300mm wafers, leading to consistent deposition rates.
Enhanced Deposition Uniformity: The precisely shaped magnetic field generated by the AMAT 0010-25739 ensures a more uniform plasma density across the target surface, resulting in more uniform thin film deposition on the wafer.
Improved Target Utilization: The magnetic field configuration can also influence the erosion pattern on the sputtering target, potentially leading to better target material utilization and reduced cost of ownership.
Designed for AMAT PVD Systems: As a genuine AMAT part for systems like the Endura II, the AMAT 0010-25739 ensures seamless integration and compatibility with the sputtering cathode and other system components, guaranteeing optimal performance.
Contributes to Film Quality: Uniform plasma and sputtering rates, facilitated by the 0010-25739, are crucial for achieving high-quality thin films with desired electrical and physical properties.
Typical Application Scenarios
The AMAT 0010-25739 300mm Magnet Assembly is specifically used within the sputtering cathodes of Applied Materials’ PVD systems that process 300mm silicon wafers, such as the Endura II. In these systems, the AMAT 0010-25739 is a key component for sputtering various materials, including metals, nitrides, and oxides, which are essential for forming the different layers in semiconductor devices. The magnetic field generated by the AMAT 0010-25739 traps electrons near the target surface, increasing the plasma density and the sputtering rate. The uniformity of this plasma, influenced by the magnet assembly’s design, directly impacts the uniformity of the deposited film on the 300mm wafer. Therefore, the AMAT 0010-25739 is critical for achieving the precise and uniform thin films required for advanced semiconductor manufacturing.
