Based on the available information, the AMAT 0040-91179 is a 300MM MCA E-CHUCK TXZ HEATER/PURGE ASSEMBLY. This component is used in Applied Materials (AMAT) semiconductor manufacturing equipment, specifically for controlling the temperature and potentially providing a purge gas flow for a 300mm Multi-Channel Analyzer (MCA) Electrostatic Chuck (E-Chuck). The “TxZ” designation likely refers to a specific configuration or material of the heater.
Detailed Parameter Table
Product Introduction
The AMAT 0040-91179 is a critical 300MM MCA E-CHUCK TXZ HEATER/PURGE ASSEMBLY designed for use in Applied Materials (AMAT) semiconductor manufacturing equipment that processes 300mm silicon wafers. This assembly integrates the functionality of heating the electrostatic chuck (ESC) to precisely control the wafer temperature and potentially providing a purge gas to the backside of the wafer. Accurate temperature control and backside purging are essential for achieving consistent wafer quality and process uniformity during various critical steps in semiconductor fabrication, such as deposition, etching, and other surface treatments. As a vital component in the wafer handling and processing system, the AMAT 0040-91179 contributes significantly to the overall efficiency and yield of advanced semiconductor manufacturing by ensuring the precise thermal and backside pressure environment required for optimal process outcomes.
Core Advantages and Technical Highlights
The AMAT 0040-91179 300MM MCA E-CHUCK TXZ HEATER/PURGE ASSEMBLY offers several key advantages for precise wafer temperature control and backside environment management:
Precise and Uniform Heating: The integrated heater ensures accurate and consistent temperature distribution across the electrostatic chuck, leading to uniform wafer temperature, which is critical for consistent processing results.
Backside Purge Capability: The “PURGE” designation indicates the assembly can deliver a controlled gas flow to the backside of the wafer. This can be used for various purposes, such as controlling heat transfer between the chuck and the wafer or managing process byproducts.
Optimized for 300mm Wafers: Specifically designed for 300mm silicon wafers, this assembly meets the requirements of modern, large-wafer semiconductor manufacturing.
Seamless AMAT System Integration: As a genuine AMAT part, the 0040-91179 ensures seamless integration and compatibility with Applied Materials’ 300mm wafer processing equipment, guaranteeing optimal performance and reliability of the ESC temperature and purge control systems.
Contributes to Wafer Quality: Precise temperature control and backside environment management provided by the 0040-91179 are crucial for achieving the desired film properties, etch rates, and other process characteristics that directly impact the quality of the semiconductor devices produced.
Typical Application Scenarios
The AMAT 0040-91179 300MM MCA E-CHUCK TXZ HEATER/PURGE ASSEMBLY is a fundamental component in various process modules within Applied Materials’ 300mm semiconductor manufacturing equipment. It is essential in deposition systems (like PVD and CVD) and etching systems where maintaining a specific wafer temperature via the electrostatic chuck and controlling the backside environment are critical for the process outcome. For example, in PVD, backside gas pressure can affect heat transfer and film stress. In etching, backside purge can help remove reaction byproducts. The AMAT 0040-91179 ensures that the 300mm wafer held by the ESC is maintained at the optimal temperature and backside pressure for the specific process step, contributing to the overall quality and uniformity of the semiconductor device fabrication.
