Description: The 0020-26822 AMAT is identified as a SHIELD 8″ HTHU DEPO LOW KNEE from Applied Materials (AMAT). This component is a crucial part within AMAT’s thin film deposition equipment, specifically designed to protect certain areas during the deposition process on 8-inch wafers. The “HTHU” likely refers to a specific hardware configuration or process within AMAT’s deposition systems.
Application Scenarios: Consider a semiconductor fabrication facility running thin film deposition processes on 8-inch silicon wafers. During these processes, it’s essential to precisely control where material is deposited to create the intricate layers of a microchip. The 0020-26822 AMAT Shield plays a critical role by masking or shielding specific regions of the wafer or the process chamber from the deposition flux. This ensures that the deposited film only grows on the intended areas, preventing unwanted material buildup and ensuring the correct patterning and functionality of the semiconductor devices being manufactured. The proper functioning of this shield is vital for achieving high precision and yield in thin film deposition.
Parameter
| Main Parameters | Value/Description |
|---|---|
| Product Model | 0020-26822 |
| Manufacturer | Applied Materials (AMAT) |
| Product Category | Shield |
| Application | 8-inch Wafer Thin Film Deposition (Likely PVD or CVD) |
| Size Compatibility | 8-inch Wafers |
| Designation | HTHU DEPO LOW KNEE |
| Material | Specification not readily available (likely a material compatible with deposition processes) |
| Condition | New or Used (commonly found on the market) |
| Associated Terms | Process Kit Part, Shielding Component |
| Function | Masking/Shielding during deposition |
| Mounting | Integrated within the deposition chamber |
Technical Principles and Innovative Values:
- Innovation Point 1: Precision Masking: The 0020-26822 AMAT is designed with precise dimensions and geometry to accurately mask specific areas of the 8-inch wafer during the deposition process, ensuring high pattern fidelity.
- Innovation Point 2: Optimized for HTHU Deposition: The “HTHU” designation indicates that this shield is specifically engineered for a particular hardware configuration or process within AMAT’s deposition systems, ensuring optimal performance and compatibility.
- Innovation Point 3: Material Compatibility: The shield is likely constructed from materials that are compatible with the deposition process environment, preventing contamination and ensuring the integrity of the deposited films.
- Innovation Point 4: Low Knee Design: The “LOW KNEE” descriptor likely refers to a specific geometric feature of the shield that is critical for its function within the deposition chamber, possibly related to gas flow or plasma confinement.
Application Cases and Industry Value: In a semiconductor manufacturing line producing memory chips, precise deposition of metal layers is crucial for creating the conductive pathways within the devices. The Applied Materials 0020-26822 Shield is used during a sputtering process to ensure that the metal film is deposited only on the desired areas of the 8-inch wafer. By accurately masking other regions, this shield prevents short circuits and ensures the correct electrical connections within the memory cells. The use of this specific shield, optimized for the HTHU deposition process, contributes to higher device yields and improved performance of the final memory products.
Related Product Combination Solutions:
- Applied Materials Deposition Chamber Components: Other parts within the AMAT deposition chamber, such as the target, gas distribution system, and wafer chuck, all work in conjunction with the 0020-26822 shield to achieve the desired film properties.
- Applied Materials Process Control Software: The software that controls the deposition process parameters, including the timing and sequence that rely on the proper function of the 0020-26822 shield.
- Vacuum Systems for Deposition Chambers: Maintain the necessary vacuum levels within the deposition chamber where the 0020-26822 operates, crucial for the quality and uniformity of the deposited films.
- RF or DC Power Supplies: Provide the energy for the sputtering or other deposition processes, with the plasma or deposition flux being shaped and directed by the 0020-26822 shield.
- Brooks Automation Wafer Handling Robots: Precisely load and unload 8-inch wafers into the deposition chamber, ensuring proper alignment with the 0020-26822 shield.
- Thin Film Metrology Tools: Used to measure the thickness and other properties of the deposited films, providing feedback on the effectiveness of the shielding provided by the 0020-26822.
- Gas Delivery Systems: Precisely control the flow of process gases into the deposition chamber for CVD processes, with the deposition area being defined by the 0020-26822 shield.
- Temperature Control Units: Manage the temperature of the wafer and other components within the deposition chamber, which can affect the deposition rate and uniformity in conjunction with the shielding provided by the 0020-26822.
Installation, Maintenance, and Full-Cycle Support: The 0020-26822 AMAT Shield requires careful installation within the Applied Materials deposition equipment, typically performed by trained AMAT service engineers to ensure proper alignment and sealing. Routine maintenance may involve periodic inspections for any signs of wear, deformation, or contamination. Cleaning procedures as recommended by AMAT are important to maintain the shield’s effectiveness and prevent particle generation.
In the event of damage or failure, replacement with a compatible 0020-26822 or an AMAT-approved alternative is necessary to ensure the continued high-quality deposition within the system. Applied Materials provides comprehensive technical support for their equipment, including this component. This includes access to detailed technical documentation, troubleshooting guides, and their global network of service engineers for on-site assistance and genuine AMAT spare parts. AMAT’s commitment to full lifecycle support aims to ensure that users can maintain the optimal performance of their advanced semiconductor manufacturing equipment.
