Description: The 0020-63185 AMAT is identified as a BLOCKER PLATE, UNIFORM FLOW -0.2 BP STAN, manufactured by Applied Materials (AMAT). This component is utilized in AMAT’s semiconductor processing equipment, likely within a Chemical Vapor Deposition (CVD) chamber, to ensure a uniform distribution of process gases across the wafer surface. The “BP STAN” likely refers to a specific standard or configuration of the blocker plate.
Application Scenarios: Consider a CVD process used to deposit a thin film on a 300mm silicon wafer. Achieving uniform film thickness and properties across the entire wafer is crucial for the performance and reliability of the resulting semiconductor devices. The 0020-63185 AMAT Blocker Plate is strategically positioned within the CVD chamber to regulate the flow of precursor gases towards the wafer. Its design, featuring specific port sizes and arrangements, ensures a uniform distribution of these gases, leading to a more consistent deposition rate across the 300mm surface. Without this uniform gas flow, variations in film thickness and composition could occur, negatively impacting device performance and yield. The 0020-63185 is therefore essential for achieving high-quality and uniform thin films in AMAT’s CVD systems.
Parameter
Technical Principles and Innovative Values:
- Innovation Point 1: Uniform Gas Distribution: The primary function of the 0020-63185 AMAT is to create a uniform flow of process gases over the wafer surface in a CVD chamber, which is critical for achieving consistent thin film deposition.
- Innovation Point 2: Optimized Port Design: The blocker plate likely features a precisely engineered array of holes or channels designed to create a specific gas flow pattern that compensates for inherent flow dynamics within the chamber.
- Innovation Point 3: Application-Specific Design: The “-0.2 BP STAN” designation suggests that this blocker plate is tailored for a specific set of CVD processes or chamber configurations within AMAT’s equipment.
- Innovation Point 4: Contribution to Process Yield: By ensuring uniform gas delivery, the 0020-63185 directly contributes to improved film quality and reduced defects, leading to higher overall wafer yields in semiconductor manufacturing.
Application Cases and Industry Value: In a semiconductor fabrication facility depositing silicon dioxide films using a TEOS (Tetraethyl orthosilicate) CVD process, achieving uniform film thickness across 300mm wafers is crucial for the performance of the gate dielectrics in transistors. The Applied Materials 0020-63185 Blocker Plate ensures that the TEOS precursor gas is evenly distributed over the wafer surface, resulting in a highly uniform oxide film. Without this component, variations in gas concentration across the wafer could lead to thickness inconsistencies and electrical performance issues. User feedback often highlights the importance of such uniform flow plates in achieving the stringent quality requirements for advanced semiconductor devices.
Related Product Combination Solutions:
- Applied Materials CVD Chamber Assembly: The complete CVD chamber that houses the 0020-63185 blocker plate, along with other components like the gas inlet, exhaust system, and wafer chuck.
- Gas Distribution Showerheads: Components that work in conjunction with the blocker plate to further optimize the delivery of process gases into the CVD chamber.
- Mass Flow Controllers (MFCs): Precisely control the flow rates of the various precursor gases that are then distributed by the blocker plate.
- Vacuum Pumps and Pressure Control Systems: Maintain the required pressure within the CVD chamber, which influences the gas flow patterns created by the blocker plate.
- Temperature Control Units: Ensure the wafer and chamber components are at the optimal temperatures for the CVD reaction, with uniform gas flow from the blocker plate contributing to temperature uniformity across the wafer.
- Wafer Handling Robots: Precisely load and unload wafers into the CVD chamber, ensuring proper positioning relative to the blocker plate for uniform processing.
- Thin Film Metrology Tools: Used to measure the thickness and uniformity of the deposited films, providing feedback on the effectiveness of the gas distribution provided by the 0020-63185.
- Process Control Software: Manages the overall CVD process parameters, including gas flows and chamber pressure, which are optimized for the specific blocker plate design.
Installation, Maintenance, and Full-Cycle Support: The 0020-63185 AMAT Blocker Plate requires careful installation within the Applied Materials CVD chamber, typically performed by trained AMAT service engineers to ensure proper alignment and sealing. The material of the blocker plate is chosen to be compatible with the CVD process gases, but routine maintenance may involve periodic inspections for any signs of deposition buildup or corrosion. Cleaning or replacement of the blocker plate may be necessary to maintain optimal gas flow uniformity and prevent particle contamination.
Applied Materials provides comprehensive technical support for their equipment, including components like the 0020-63185 blocker plate. This includes detailed chamber assembly diagrams, maintenance procedures, and access to their global network of service engineers for on-site assistance and genuine AMAT spare parts. AMAT’s commitment to full lifecycle support aims to ensure that users can maintain the optimal performance and uniformity of their CVD processes.
