Description: The 0021-33621 AMAT is identified as a SHLD MIDDLE MATRIX CU ENDURA 2, likely a middle shield component made of Copper (Cu) and designed for the ENDURA 2 platform from Applied Materials (AMAT). This shield is a crucial part within AMAT’s Physical Vapor Deposition (PVD) systems, specifically used in the ENDURA 2 chamber for 300mm wafer processing. Its function is to protect specific areas within the chamber and help control the deposition process of copper films, which are essential for interconnects in advanced semiconductor devices.

Application Scenarios: Consider a high-throughput semiconductor fabrication line manufacturing advanced microprocessors using copper metallization on 300mm wafers. During the PVD process in an AMAT ENDURA 2 chamber, precise control over the deposition of copper is paramount to ensure the quality and reliability of the interconnect layers. The 0021-33621 AMAT Middle Shield is strategically positioned within the chamber to prevent unwanted copper deposition on critical areas, such as insulators or other chamber components. By precisely defining the deposition zone, this shield contributes to the uniformity and purity of the copper films deposited on the wafers, ultimately leading to higher device performance and yield.

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Technical Principles and Innovative Values:

• Innovation Point 1: Optimized for ENDURA 2 Platform: The 0021-33621 AMAT is specifically designed for the ENDURA 2 PVD chamber, ensuring seamless integration and optimal performance within this widely used platform for copper metallization.
• Innovation Point 2: Prevents Unwanted Copper Deposition: As a “middle shield,” this component plays a critical role in protecting specific areas of the process chamber from copper deposition, minimizing maintenance and preventing particle contamination.
• Innovation Point 3: Contributes to Deposition Uniformity: The geometry and placement of the middle shield can influence the plasma distribution and the flux of copper atoms towards the wafer, contributing to improved film uniformity.
• Innovation Point 4: Copper Material Compatibility: Being made of copper ensures compatibility with the copper sputtering process and minimizes the introduction of foreign materials into the deposition environment.

Application Cases and Industry Value: In a leading semiconductor foundry producing high-speed memory devices with copper interconnects on 300mm wafers, maintaining a clean and controlled PVD process is essential for achieving the required electrical performance. The Applied Materials 0021-33621 Middle Shield in the ENDURA 2 chambers helps to ensure that copper is deposited only on the intended areas of the wafers, preventing short circuits and ensuring the integrity of the complex wiring structures. The reliable shielding provided by this component contributes to higher wafer yields and the production of more reliable and faster memory chips.

Related Product Combination Solutions:

1. Applied Materials ENDURA 2 PVD Chamber Assembly: The complete PVD chamber that houses the 0021-33621 middle shield, along with the copper target, wafer chuck, upper and lower shields, and other essential components.
2. Applied Materials Upper and Lower Shields (for ENDURA 2): These shields work in conjunction with the middle shield to provide comprehensive protection and control of the deposition process within the chamber.
3. Applied Materials Process Control Software (for ENDURA 2): The software that manages the sputtering process parameters, including power, gas flow, and deposition time, which are optimized for the specific chamber configuration including the middle shield.
4. DC Power Supplies (for Copper Sputtering): Provide the power to the copper target, generating the copper plasma that is directed towards the wafer under the influence of the shields.
5. Argon Gas Delivery System: The inert gas used to create the plasma for sputtering copper, with its flow rate and pressure being critical parameters for the deposition process within the shielded environment.
6. Brooks Automation or other Wafer Handling Robots (for 300mm wafers): Precisely load and unload the large wafers into the ENDURA 2 chamber, ensuring proper positioning for uniform copper deposition.
7. Thin Film Metrology Tools (for Copper Films): Used to measure the thickness, resistivity, and uniformity of the deposited copper films, providing feedback on the effectiveness of the shielding.
8. Vacuum Systems (for PVD Chambers): Maintain the high vacuum environment required for high-quality PVD processes, with the shields helping to contain the deposition within a defined volume.

Installation, Maintenance, and Full-Cycle Support: The 0021-33621 AMAT Middle Shield requires careful installation within the AMAT ENDURA 2 PVD chamber, typically performed by trained AMAT service engineers to ensure proper alignment and sealing. Routine maintenance may involve periodic inspections for any signs of copper buildup, erosion, or damage. Cleaning or replacement of the shield according to AMAT’s maintenance schedules is important to maintain optimal deposition uniformity and prevent particle contamination that could lead to defects.

Applied Materials provides comprehensive technical support for their ENDURA 2 PVD equipment, including components like the 0021-33621 middle shield. This includes detailed chamber assembly diagrams, maintenance procedures, and access to their global network of service engineers for on-site assistance and genuine AMAT spare parts. AMAT’s commitment to full lifecycle support aims to ensure that users can maintain the optimal performance and yield of their advanced semiconductor manufacturing equipment.

Contact us to learn more about how the 0021-33621 AMAT Middle Shield contributes to precise and high-quality copper deposition in your AMAT ENDURA 2 PVD systems for 300mm wafers.