Description: The 0021-42136 AMAT is identified as a FACEPLATE, LOWK XTRA ROW EXTENDING FLO, designed for 300mm wafer processing equipment manufactured by Applied Materials (AMAT). This faceplate is a key component, likely part of a gas distribution system (such as a showerhead) within a plasma processing chamber. Its design, featuring “LOWK XTRA ROW EXTENDING FLO,” suggests it’s optimized for processes involving low-k dielectric materials and requires an extended and uniform flow of process gases across the 300mm wafer surface.
Application Scenarios: Consider a semiconductor fabrication line utilizing plasma etching to create intricate patterns in low-k dielectric films on 300mm wafers. Achieving uniform etching is crucial for the performance and reliability of the advanced interconnect structures. The 0021-42136 AMAT Faceplate, integrated into the gas distribution system above the wafer, plays a vital role in ensuring a consistent and extended flow of etchant gases across the entire 300mm surface. The “XTRA ROW EXTENDING FLO” likely indicates a specific design that enhances the uniformity of the gas distribution, which is particularly important when processing delicate low-k materials that can be sensitive to non-uniform plasma exposure. The precise and uniform delivery of process gases enabled by this faceplate contributes directly to improved etching uniformity, reduced defects, and higher yields in the manufacturing of advanced integrated circuits.
Parameter
| Main Parameters | Value/Description |
|---|---|
| Product Model | 0021-42136 |
| Manufacturer | Applied Materials (AMAT) |
| Product Category | Faceplate (likely for Gas Distribution/Showerhead) |
| Application | 300mm Wafer Plasma Etching (Low-k Dielectrics) |
| Size Compatibility | 300mm Wafers |
| Designation | LOWK XTRA ROW EXTENDING FLO |
| Material | Specification not readily available (likely compatible with plasma etching environment) |
| Condition | Commonly found as used, new may also be available |
| Associated Terms | Showerhead Component, Gas Distribution Plate |
| Function | Ensures uniform and extended flow of process gases |
| Mounting | Part of the gas distribution assembly in the plasma chamber |
Technical Principles and Innovative Values:
- Innovation Point 1: Optimized for Low-k Dielectrics: The “LOWK” designation indicates that the 0021-42136 AMAT Faceplate is specifically designed to facilitate uniform processing of low-k dielectric materials, which are increasingly used in advanced interconnect structures due to their electrical properties.
- Innovation Point 2: Extended Flow Design: The “XTRA ROW EXTENDING FLO” likely refers to a specific arrangement of gas outlets on the faceplate that ensures a more uniform and extended distribution of process gases across the large 300mm wafer, crucial for process uniformity.
- Innovation Point 3: Uniform Plasma Generation: By providing a uniform gas flow, the faceplate contributes to the generation of a more uniform plasma above the wafer, leading to consistent etching or deposition rates across the entire surface.
- Innovation Point 4: Integration within AMAT Systems: As a component designed by Applied Materials, the 0021-42136 ensures seamless integration and optimal performance within their specific plasma processing chamber designs for 300mm wafers.
Application Cases and Industry Value: In a leading semiconductor manufacturing facility producing high-speed microprocessors with advanced interconnects utilizing low-k dielectric materials on 300mm wafers, achieving uniform etching of these delicate films is critical for device performance and reliability. The Applied Materials 0021-42136 Faceplate ensures a consistent and extended flow of etching gases, leading to improved uniformity of the etched patterns and reduced damage to the low-k materials. This results in higher yields of high-performance microprocessors with enhanced speed and lower power consumption.
Related Product Combination Solutions:
- Applied Materials Plasma Etch Chamber Assembly (for 300mm wafers): The complete etch chamber that houses the 0021-42136 faceplate, along with electrodes, gas inlets, exhaust systems, and wafer chuck.
- Applied Materials Upper Electrode/Showerhead Assembly: The larger assembly that incorporates the 0021-42136 faceplate and delivers the process gases into the plasma chamber.
- RF Power Generators: Provide the energy to generate the plasma used for etching, with the uniformity of the plasma being influenced by the gas distribution from the faceplate.
- Mass Flow Controllers (MFCs): Precisely control the flow rates of the various process gases that are then distributed uniformly by the faceplate.
- Vacuum Pumps and Pressure Control Systems: Maintain the required pressure within the etch chamber, which influences the plasma characteristics and the effectiveness of the gas distribution.
- Wafer Handling Robots (for 300mm wafers): Precisely load and unload the large wafers into the etch chamber, ensuring proper positioning below the gas distribution faceplate.
- Endpoint Detection Systems: Monitor the etching process and provide feedback to the control system, ensuring uniform removal of the low-k dielectric layers.
- Thin Film Metrology Tools: Used to measure the uniformity of the etched features and the remaining film thickness, providing feedback on the effectiveness of the gas distribution from the 0021-42136.
Installation, Maintenance, and Full-Cycle Support: The 0021-42136 AMAT Faceplate requires careful installation within the Applied Materials plasma etch chamber, typically performed by trained AMAT service engineers to ensure proper alignment and sealing. Routine maintenance may involve periodic inspections for any signs of corrosion, deposition buildup, or damage to the gas outlets. Cleaning or replacement of the faceplate according to AMAT’s maintenance schedules is necessary to maintain optimal gas flow uniformity and prevent particle contamination.
Applied Materials provides comprehensive technical support for their plasma processing equipment, including components like the 0021-42136 faceplate. This includes detailed chamber assembly diagrams, maintenance procedures, and access to their global network of service engineers for on-site assistance and genuine AMAT spare parts. AMAT’s commitment to full lifecycle support aims to ensure that users can maintain the optimal performance and yield of their advanced semiconductor manufacturing equipment.
