Description: The 0021-53986 AMAT is identified as a Liner, Upper, ALN, ENCORE 2, designed for 300mm wafer processing equipment manufactured by Applied Materials (AMAT). This upper liner, made of Aluminum Nitride (ALN), is a crucial component within the process chamber of the ENCORE 2 platform. Liners serve to protect the chamber walls from the harsh environment of plasma processing, control the chamber’s surface properties, and minimize contamination, thereby ensuring consistent and high-quality semiconductor fabrication.
Application Scenarios: Consider a plasma etching process in an AMAT ENCORE 2 chamber used for etching dielectric layers on 300mm silicon wafers. The plasma generated within the chamber can be highly reactive and could potentially damage the chamber walls over time, leading to particle generation and process instability. The 0021-53986 AMAT Upper Liner, made of ALN, is installed in the upper section of the chamber to act as a protective layer. Aluminum Nitride is chosen for its excellent resistance to plasma erosion, high thermal conductivity, and low particle generation characteristics. By containing the plasma and minimizing interaction with the underlying chamber materials, this liner helps to maintain a clean and stable processing environment, ensuring consistent etch rates and reducing defects on the 300mm wafers, ultimately leading to higher yields in advanced semiconductor manufacturing.
Parameter
| Main Parameters | Value/Description |
|---|---|
| Product Model | 0021-53986 |
| Manufacturer | Applied Materials (AMAT) |
| Product Category | Liner, Upper |
| Application | 300mm Wafer Plasma Etching/Deposition (ENCORE 2 Platform) |
| Material | Aluminum Nitride (ALN) |
| Size Compatibility | 300mm Wafers |
| Condition | Commonly found as new (open box) or used |
| Associated Terms | Chamber Liner, Process Kit Part |
| Function | Protects chamber walls, minimizes contamination, controls surface properties |
| Mounting | Installed in the upper section of the ENCORE 2 process chamber |
Technical Principles and Innovative Values:
- Innovation Point 1: Plasma Erosion Resistance: Aluminum Nitride (ALN) offers superior resistance to the corrosive effects of various plasma chemistries used in semiconductor processing, significantly extending the lifespan of the chamber and reducing the frequency of liner replacement.
- Innovation Point 2: Low Particle Generation: The ALN material is selected for its low tendency to generate particles when exposed to plasma, which is critical for maintaining a clean processing environment and preventing defects on the delicate 300mm wafers.
- Innovation Point 3: Thermal Management: ALN has high thermal conductivity, which helps to dissipate heat generated during plasma processing, contributing to better temperature control within the chamber and improved process uniformity.
- Innovation Point 4: Optimized for ENCORE 2 Platform: This upper liner is specifically designed for the geometry and process requirements of AMAT’s ENCORE 2 chamber for 300mm wafer processing, ensuring seamless integration and optimal performance.
Application Cases and Industry Value: In a high-volume semiconductor fabrication facility running continuous plasma etching of тонкие пленки (thin films) on 300mm wafers using AMAT ENCORE 2 systems, maintaining a stable and clean processing environment is crucial for achieving consistent etch rates and minimizing defects. The Applied Materials 0021-53986 Upper Liner, made of ALN, effectively protects the upper chamber walls from plasma erosion and significantly reduces particle contamination. This leads to fewer wafer defects, improved process repeatability, and higher overall equipment efficiency, contributing to increased yields and reduced manufacturing costs for advanced integrated circuits.
Related Product Combination Solutions:
- Applied Materials Lower Liners (for ENCORE 2): These liners protect the lower sections of the chamber and work in conjunction with the upper liner to provide comprehensive protection.
- Applied Materials Process Chamber Assembly (ENCORE 2): The complete etch or deposition chamber that houses the upper and lower liners, electrodes, gas distribution system, and wafer chuck.
- Plasma Confinement Rings: Components used to help contain the plasma within a specific region of the chamber, potentially interacting with the upper liner to optimize plasma uniformity.
- Vacuum Pumps and Throttle Valves: Maintain the necessary vacuum levels within the process chamber, which is crucial for the plasma processes where the ALN liner provides protection.
- Gas Delivery Systems: Precisely control the flow of process gases into the chamber, with the liner material influencing the surface chemistry and plasma behavior.
- Wafer Handling Robots (for 300mm wafers): Precisely load and unload the large wafers into the ENCORE 2 chamber, ensuring proper positioning within the protected environment.
- Endpoint Detection Systems: Monitor the progress of the etching or deposition process, helping to ensure uniformity across the wafer within the ALN-lined chamber.
- Cleaning and Conditioning Kits for Chamber Components: Specialized kits used to periodically clean the ALN liner and other chamber components to remove any accumulated byproducts and maintain optimal process conditions.
Installation, Maintenance, and Full-Cycle Support: The 0021-53986 AMAT Upper Liner (ALN) requires careful installation within the AMAT ENCORE 2 process chamber, typically performed by trained AMAT service engineers to ensure proper fit and sealing. While ALN is highly durable, routine maintenance may involve periodic inspections for any signs of excessive wear or deposition buildup. Cleaning procedures as recommended by AMAT are important to maintain the liner’s protective properties and minimize particle generation. Replacement of the liner will be necessary over time, depending on the severity and duration of the plasma exposure.
Applied Materials provides comprehensive technical support for their ENCORE 2 equipment, including chamber liners like the 0021-53986. This includes detailed chamber assembly diagrams, maintenance procedures, and access to their global network of service engineers for on-site assistance and genuine AMAT spare parts. AMAT’s commitment to full lifecycle support aims to ensure the continuous and reliable operation of their advanced 300mm wafer processing equipment.
Contact us to learn how the durable and low-particle generating 0021-53986 AMAT Upper Liner (ALN) can contribute to a stable and high-yield plasma processing environment in your ENCORE 2 systems for 300mm wafers.
