Product Overview
The Applied Materials 0040-88628 stands as a vital electromechanical assembly, predominantly integrated within the sophisticated wafer handling systems of Applied Materials’ semiconductor processing equipment, notably within platforms like the Producer SE. This specific component, the Applied Materials 0040-88628, typically serves as a critical link or joint within a robotic arm mechanism. Its primary function is to enable precise and repeatable motion, facilitating the delicate transfer of silicon wafers between various processing chambers or stages within the semiconductor fabrication facility. The reliable operation of the Applied Materials 0040-88628 is paramount to maintaining the efficiency and throughput of the automated wafer transport system, directly impacting the overall productivity of the semiconductor manufacturing line. Engineered to meet the stringent cleanliness requirements of semiconductor cleanrooms, the Applied Materials 0040-88628 is designed to minimize particle generation, thereby safeguarding the integrity of the wafers undergoing processing. Applied Materials’ dedication to precision engineering is clearly reflected in the design and performance of the 0040-88628.
Within the intricate choreography of semiconductor wafer processing, the Applied Materials 0040-88628 plays a key role in ensuring the smooth and accurate movement of substrates. As an integral element of the robotic handling system in platforms such as the Producer SE, the 0040-88628 contributes to the precise timing and coordination necessary for complex, multi-step fabrication sequences. Its robust construction and adherence to stringent cleanroom protocols are essential for minimizing the risk of wafer contamination and unexpected equipment downtime. The accuracy and dependability of the Applied Materials 0040-88628 are therefore indispensable for optimizing production yields and reducing operational costs in high-volume semiconductor manufacturing environments.
Technical Specifications
Main Features and Advantages
The Applied Materials 0040-88628 is engineered for high-performance wafer transfer, prioritizing accuracy and repeatability. Its precise mechanical design ensures smooth and controlled movement of the robotic arm, minimizing the potential for shocks or vibrations that could damage delicate silicon wafers. This accuracy translates directly into improved process consistency and reduced wafer breakage rates, contributing to higher overall yields in semiconductor manufacturing. The robust construction of the 0040-88628 guarantees long-term reliability and minimal maintenance requirements, crucial for maximizing equipment uptime in demanding production schedules.
Minimized Particle Generation: A significant design consideration for the Applied Materials 0040-88628 is its suitability for cleanroom environments. The materials and surface finishes are carefully selected to minimize the generation of particulate matter, a critical factor in preventing contamination of semiconductor wafers. This cleanroom compatibility ensures that the 0040-88628 can be seamlessly integrated into advanced semiconductor fabrication facilities without compromising the stringent cleanliness standards required.
Enhanced System Integration: Specifically designed for integration within Applied Materials’ wafer processing platforms, such as the Producer SE, the 0040-88628 ensures optimal compatibility with other system components. This seamless integration simplifies installation and facilitates precise control of the robotic arm’s movements through the main system controller. The Applied Materials 0040-88628 is a testament to the integrated design philosophy of Applied Materials’ automated wafer handling solutions.
Durability and Longevity: Built to withstand the rigors of continuous operation in high-volume semiconductor manufacturing, the Applied Materials 0040-88628 is constructed from durable, high-quality materials. This robust design ensures a long operational life and reduces the frequency of replacements, contributing to lower overall operating costs and increased equipment availability. The reliable performance of the 0040-88628 is essential for maintaining consistent production output.
Application Field
The Applied Materials 0040-88628 is a key component in the automated wafer handling systems used throughout the semiconductor manufacturing process. Its primary application lies within the robotic arms and transfer mechanisms that move silicon wafers between different processing modules in equipment such as the Applied Materials Producer SE. This precise transfer is crucial for various stages of semiconductor fabrication, including thin film deposition, etching, lithography, and metrology. The Applied Materials 0040-88628 ensures the accurate and reliable movement of wafers, which is essential for maintaining process integrity and maximizing throughput.
In semiconductor fabrication plants, the Applied Materials 0040-88628 contributes to the overall automation and efficiency of wafer processing. Its cleanroom-compatible design makes it suitable for the ultra-clean environments required for advanced semiconductor manufacturing. The reliability of the Applied Materials 0040-88628 is paramount in minimizing downtime and ensuring the continuous operation of expensive and critical semiconductor processing equipment. By facilitating smooth and accurate wafer transfer, the Applied Materials 0040-88628 plays a direct role in improving production yields and reducing manufacturing costs.
Related Products
Within the Applied Materials ecosystem, the 0040-88628 is often used in conjunction with other components that contribute to the automated handling and processing of semiconductor wafers. These may include:
- 0040-93785: Another robotic arm joint or link, likely used in a different axis or part of the wafer transfer system.
- 0010-xxxx: Various robotic end effectors or grippers designed to securely hold and transport wafers.
- 0190-xxxx: Linear and rotary actuators that provide the motive force for the robotic arm movements.
- Sensors and Encoders: Devices that provide feedback on the position and velocity of the robotic arm components, ensuring precise control.
- Vacuum Chucks: Mechanisms used to hold wafers securely during processing within different modules.
- Wafer Alignment Systems: Components that ensure the precise orientation of wafers before and after transfer.
- System Control Modules: Electronic units that coordinate the movements of the robotic arm and other automation components.
- Load Lock Assemblies: Chambers that allow wafers to be introduced into and removed from vacuum processing environments.







