Description: The AMAT 0041-12192 is a critical component identified as a Baffle Assembly, designed for precise gas flow management within AMAT’s advanced semiconductor wafer processing equipment. This carefully engineered assembly plays a vital role in directing and controlling the movement of process gases within the reaction chamber, contributing to uniformity and efficiency in various fabrication processes.
Application Scenarios: Consider a plasma etching process where achieving anisotropic etching profiles is crucial for creating fine features on silicon wafers. The controlled flow of etchant gases and plasma species within the chamber is paramount for achieving this directionality. The AMAT 0041-12192 baffle assembly is strategically placed within the etching chamber to guide the gas flow, ensuring that the reactive species are directed towards the wafer surface in a controlled manner and that byproducts are effectively removed. This directly addresses the challenge of achieving precise feature definition and minimizing unwanted etching, a key requirement in advanced semiconductor manufacturing.
Parameter:
| Main Parameters | Value/Description |
|---|---|
| Product Model | 0041-12192 |
| Manufacturer | AMAT (Applied Materials) |
| Product Category | Baffle Assembly |
| Application | Gas Flow Management in Wafer Processing (e.g., Etch, Deposition) |
| Wafer Size Compatibility | 300 mm (Designed for the industry-standard 300mm wafer size) |
| Material | (Likely specialized materials resistant to process gases and plasma) |
| Design Features | (Potentially includes specific shapes, vanes, or apertures for flow control) |
| Gas Inlet/Outlet Interface | (Specific interface points for gas flow) |
| Pressure Rating | (Designed to withstand specific process gas pressures) |
| Temperature Rating | (Compatible with the operating temperatures of the process chamber) |
| Dimensions | (Specific dimensions are likely proprietary to AMAT) |
| Weight | (Specific weight is likely proprietary) |
Technical Principles and Innovative Values:
- Innovation Point 1: Optimized Gas Flow Direction – The 0041-12192 baffle assembly is engineered with a specific geometry and internal structure to precisely direct the flow of process gases within the reaction chamber. This optimized flow management contributes significantly to process uniformity and efficiency, ensuring that reactive species are delivered effectively to the wafer surface.
- Innovation Point 2: Enhanced Byproduct Removal – The design of the 0041-12192 likely also facilitates the efficient removal of reaction byproducts from the wafer surface and the chamber. This prevents the re-deposition of unwanted materials and ensures a clean processing environment, crucial for achieving high-quality results.
- Innovation Point 3: Durable Material Selection – Constructed from materials carefully chosen for their resistance to the harsh chemical and plasma environments within the processing chamber, the 0041-12192 ensures a long operational lifespan and minimizes the risk of contamination, contributing to stable and reliable production.
Application Cases and Industry Value:
In a leading manufacturer of advanced microprocessors, the AMAT 0041-12192 baffle assembly was a key component in their reactive ion etching (RIE) reactors used for creating the intricate gate structures of transistors. The precise gas flow management provided by this baffle assembly enabled highly anisotropic etching, resulting in the accurate formation of critical dimensions. This enhanced control directly translated to improved device performance and higher yields of complex microprocessors. User feedback highlighted the consistent performance of the AMAT 0041-12192 in maintaining process stability and contributing to the overall quality of the etched features.
Related Product Combination Solutions:
- AMAT Gas Delivery Systems: These systems precisely control the flow rates and composition of the process gases that are then managed by the 0041-12192 baffle.
- AMAT Process Chambers: The 0041-12192 is an integral part of specific AMAT process chambers designed for various 300mm wafer fabrication steps.
- AMAT Vacuum Systems: The baffle assembly works in conjunction with the vacuum system to maintain the desired pressure and flow dynamics within the chamber.
- RF Generators and Matching Networks: In plasma-enhanced processes, these components generate and control the plasma whose interaction with the gases is influenced by the baffle.
- Pressure Control Systems: These systems work to maintain the desired pressure levels within the process chamber, influencing the gas flow managed by the baffle.
- Exhaust and Abatement Systems: The baffle assembly contributes to directing exhaust gases towards the outlet, where they are then treated by abatement systems.
- Sensors and Monitoring Systems: These systems provide data on gas flow rates and concentrations within the chamber, allowing for optimization of the baffle’s performance.
- Process Control Software: AMAT’s software platforms monitor and control the various parameters of the wafer processing equipment, including those related to gas flow and the baffle’s function.
Installation, Maintenance, and Full-Cycle Support:
Installation of the AMAT 0041-12192 typically requires specialized training and adherence to AMAT’s detailed procedures to ensure proper positioning and integration within the process chamber for optimal gas flow management. Maintenance primarily involves periodic inspection for any signs of blockage or corrosion and cleaning or replacement as per AMAT’s recommendations to maintain the intended gas flow patterns. AMAT provides comprehensive technical support, including detailed manuals, training programs, and experienced field service engineers who can assist with installation, troubleshooting, and preventative maintenance, ensuring the long-term reliability and performance of their equipment.
For inquiries regarding spare parts, service, or customized solutions for your AMAT wafer processing equipment, please contact us.
