Product Overview
The AMAT E17409500 is a precision platen / electrostatic chuck (ESC) assembly used within advanced semiconductor wafer processing equipment, particularly in Applied Materials vacuum / ion implant or deposition systems. As a critical component of wafer handling and thermal control, the AMAT E17409500 provides stable electrostatic clamping, uniform thermal contact, and robust mechanical support under extreme vacuum, temperature, and plasma environments. The design is engineered to integrate seamlessly into AMAT tool platforms or retrofits, ensuring high reliability and compatibility.
In typical system architectures, E17409500 functions as the interface between the wafer substrate and the chucking electrode / platen infrastructure. Its role is central to achieving high process uniformity, minimal thermal gradients, and secure wafer transport. The AMAT E17409500 is often supplied as a subassembly complete with embedded electrodes, insulators, and mechanical mounting features. Because it is manufactured (or procured) to exacting OEM standards, E17409500 serves as a drop-in replacement in matched tool configurations, minimizing downtime and simplifying maintenance logistics.
As part of the broader ecosystem of AMAT (and Varian-supplied) wafer processing parts, AMAT E17409500 is positioned as a mid-level to critical spare — not just a consumable but a structural component whose integrity and performance directly influence yield and throughput. Deploying a well-qualified AMAT E17409500 contributes tangible value in maintaining tool uptime, thermal stability, and wafer clamping reliability in fabs that demand precision at the nanoscale.
Technical Specifications
| Parameter Name | Parameter Value |
|---|---|
| Product Model | E17409500 |
| Manufacturer | Applied Materials (AMAT) / Varian OEM line |
| Product Type | Electrostatic Chuck / Platen Assembly |
| Wafer Diameter Compatibility | ~200 mm / 300 mm (depending on tool variant) |
| Electrode Structure | Multi-zone embedded electrodes |
| Dielectric Material | High-purity ceramic or composite (e.g., AlN, SiC, or similar) |
| Mounting Interface | Custom AMAT tool flange or bolt pattern |
| Thermal Conductivity | High (tool-specific design) |
| Leak Rate / Vacuum Integrity | Ultra-high vacuum compatible, <10⁻⁹ Torr leak equivalent |
| Operating Temperature Range | Typically –20 °C to +200 °C (tool-dependent) |
| Electrical Insulation Resistance | >10⁹ Ω under vacuum |
| Lifetime / Wear Cycles | Designed for long service life in fab environment |
Note: Exact values for dimensions, electrode count, dielectric thickness, and thermal conductance may vary across tool revisions; for precise values refer to the OEM’s detailed drawing package.
Main Features and Advantages
The AMAT E17409500 offers a robust combination of performance, manufacturability, and maintainability suited for demanding semiconductor manufacturing environments. Its embedded multi-zone electrode architecture enables fine control of clamping voltage distribution, improving wafer flatness and reducing electrostatic stress across the die surface. This translates into higher yield consistency and lower defectivity.
Thermally, the E17409500 is constructed with high-conductivity dielectric materials and precision bonding to ensure minimal thermal resistance between the wafer and baseplate. This enables more uniform heating/cooling and reduces wafer thermal lag — critical in thermal anneal, deposition, or implantation cycles. The mechanical design emphasizes rigidity and dimensional stability under repeated thermal cycling, helping maintain alignment and process repeatability over many cycles.
Another strong advantage is its vacuum integrity: the AMAT E17409500 is precisely manufactured and tested for minimal outgassing and leak tightness, ensuring it does not perturb chamber vacuum or introduce contamination. Because it is typically offered as a pre-assembled, tool-compatible module, installation and replacement are simplified, reducing mean time to repair (MTTR). The design allows for modular electrode replacement or surface reconditioning in many cases, extending the service life of the platen.
In competitive comparison, AMAT E17409500 stands out by offering a proven track record in AMAT / Varian tool lines, with known compatibility, replacement support, and documented performance in high-volume fab environments. Its balance of electrode performance, thermal management, vacuum integrity, and physical robustness is a key differentiator for fabs requiring reliability at scale.
Application Field
The AMAT E17409500 is principally deployed in semiconductor wafer processing tools — especially within vacuum, plasma, deposition, etch, or ion implantation systems. In an ion implanter or a high-energy deposition tool, the E17409500 sits at the heart of wafer handling, ensuring that substrates are firmly clamped and thermally controlled throughout process cycles. In this setting, it enables precise dose control, minimal wafer drift, and consistent thermal profiles, all of which are essential for advanced node device fabrication.
In chemical vapor deposition (CVD), atomic layer deposition (ALD), or plasma-enhanced processes, the E17409500 ensures thermal uniformity of the wafer under plasma exposure, mitigating edge effects and improving film uniformity. In etch or plasma processing, its dielectric and surface properties play a part in handling ion flux, charge mitigation, and wafer charging management.
Beyond pure semiconductor fabs, AMAT E17409500 may also find use in R&D or pilot-line process tools that replicate production conditions. In cases of tool refurbishment or upgrade, it often serves as a replacement or upgrade path for legacy platen / electrostatic chuck assemblies, preserving compatibility with OEM control schemes and mechanical interfaces.
Fabs that require high throughput, tight process windows, and minimal downtime benefit directly from using a validated AMAT E17409500, as it reduces the risk of nonconformance due to wafer slip, thermal gradients, or electrode failure. In clustering or multi-chamber architectures, consistent performance of the E17409500 helps ensure cross-chamber uniformity and simplifies process tuning efforts.
Related Products
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E19289040: A related electrostatic chuck assembly variant often paired with E17409500 in certain tool lines.
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E19589040: Another ESC model that can serve as a drop-in replacement in some configurations where E17409500 is used.
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E193000351: A shield / ring component associated with the platen assembly that supports or protects E17409500.
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E19321290: A power supply / control module often used to drive the electrode voltages feeding E17409500.
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E17319560: A liner or insulating component assembly used in tool modules that sit adjacent to E17409500.
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AMAT 0190-14090: The compatible electrostatic chuck power supply which provides the high-voltage bias to E17409500 in its operational environment.
These related parts either complement (E19321290, 0190-14090) or share assembly lineage (E19289040, E19589040) with the E17409500, offering alternative configurations, spares, or support subassemblies.
Installation and Maintenance
Pre-installation preparation: Before installing E17409500, ensure the chamber is clean, free of particulates, and that the mating surface and mounting flange are within tolerance. Verify that the tool’s vacuum seal interface, mounting bolt pattern, and alignment fixtures are precisely matched to E17409500. Check that the electrode wiring harness connector (voltage leads, thermistor / temperature sensor wires, etc.) is compatible and properly routed. Confirm that the ambient environment (vacuum cleanliness, baseplate temperature, residual gas composition) meets OEM specifications for outgassing and contamination control. Also verify grounding and electrostatic isolation to prevent arcing or charge accumulation during high-voltage operation.
Maintenance recommendations: Periodically inspect the surface of E17409500 for wear, scrubbing, or dielectric degradation, and clean using the approved solvents under vacuum conditions to avoid particle shedding. Monitor electrode leakage current, insulation resistance, and surface resistivity over time to detect early degradation. If the platen supports zonal electrodes, verify zone balancing and ensure no electrode shorts or drift. During preventive maintenance downtime, perform requalification tests (leak checks, dielectric breakdown tests, thermal response calibration) on E17409500. Where possible, maintain a refurbishment cycle: after significant usage, the E17409500 surface or dielectric layers may be refurbished or resurfaced rather than replaced entirely. Keep a documented log of usage hours, cycle counts, diagnostics readings, and any anomalies to guide long-term reliability assessments.
Product Guarantee
The AMAT E17409500 is delivered under stringent quality assurance processes, including inspection, vacuum bake-out, electrode functional testing, and dimensional verification to meet tight OEM tolerances. We guarantee that every E17409500 unit shipped is free from defects in materials and workmanship under normal use, and it is backed by a standard warranty against premature failure. In the warranty period, we commit to repair or replace any E17409500 found defective under normal operating conditions, subject to proper installation and handling.
Beyond warranty, we offer technical support, replacement parts, and refurbishment services for E17409500 to extend its lifecycle and maximize return on investment. Our team can assist in installation guidance, failure analysis, and performance tuning of the E17409500 in your specific tool environment. With careful handling and routine maintenance, the E17409500 is engineered to deliver reliable, high-precision operation over extended production campaigns, reflecting our confidence in its role as a critical component in semiconductor manufacturing systems.
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