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810-046015-010 LAM

Original price was: $9,765.00.Current price is: $6,452.00.

Product Core Brief

  • Model: 810-046015-010 (Revision C confirmed on available listings)
  • Brand: Lam Research Corporation
  • Series: Internal designation “VIOP III” (also listed as VOIP III) board family
  • Core Function: Motion I/O and discrete interface PCBA for wafer transport synchronization and safety interlock management
  • Type: VMEbus Motion & Discrete I/O Printed Circuit Board Assembly
  • Key Specs: Multi-axis stepper command generation; differential encoder feedback; <1 ms motion interlock fault response
  • Condition: ⚠️ Discontinued — limited stock. Sourcing is almost entirely used/working pulls or new surplus.
  • Compatibility: Lam 2300 Flex, Kiyo, Exelan 200/300 mm plasma etch platforms
Category: SKU: 810-046015-010 LAM
  • Email:sales@sxrunsheng.cn
  • Phone:+86 15340667322
  • Whatsapp:+86 15340667322
  • Description

    Product Introduction

    The LAM 810-046015-010 is a VMEbus motion and discrete I/O board pulled from Lam Research’s 2300-series etch tools. It sits between the tool’s master SBC and the stepper motors driving wafer transport, reading encoder feedback and validating chamber door interlocks before any transfer cycle begins.

    Its critical differentiator is RF noise isolation. Unshielded substitute boards pick up plasma RF cross-talk that trips false overtravel faults mid-batch. This board carries 1500 VAC reinforced isolation and onboard ferrite filtering for exactly that reason. Sub-millisecond interlock response keeps wafer batches from aborting due to phantom faults.

    810-046015-010 LAM 810-046015-010 LAM

     

    Installation & Configuration Guide

    Phase 1 — Pre-Installation (est. 10 min)
    De-energize the VME rack and verify the 5 V / ±12 V bus is dead with a Fluke 115 multimeter. Export all motion axis velocity/acceleration profiles and interlock trigger thresholds via the tool HMI. Photograph the board slot position and all cable routing before removal.

    Phase 2 — Removal (est. 5 min)
    Label every cable connector. Release the metal ejector latches and pull the board straight out along the guide rails. Inspect backplane connector pins for burn marks or corrosion. Compare the Revision letter on the old board — Rev 008 and Rev 010 differ in motion register mapping.

    Phase 3 — Installation (est. 10 min)
    ESD wrist strap on, grounded to rack. Verify the replacement is 810-046015-010 Rev C. Slide the board into the guide rails and press until the backplane connector seats. Secure the ejector latches. Reconnect all labeled cables.

    Phase 4 — Power-On & Testing (est. 15 min)
    Restore power. Confirm the board’s status LEDs illuminate. Open the tool software and verify the VME bus recognizes the board. Run a single-axis motion command and confirm encoder feedback tracks correctly. Test one chamber door interlock — verify the fault response trips under 1 ms. Log the swap with date, part number, and revision.

    Troubleshooting Quick-Reference:

    • No VME communication → check backplane connector seating, slot addressing
    • False overtravel faults → verify 1500 VAC isolation ground connection is intact
    • Motion telemetry loss → confirm tool master SBC firmware is v7.1.2 or higher
    • PCS v8.1 or newer → ❗ this board drops native VME register handshake compatibility; do not install in a PCS 8.1+ tool without confirming with Lam field service